Section: PI Bond
/INS. PiBond today announced the latest key milestone in its innovative SAP platform. SAP’s metal oxide solution revolutionizes the way in which manufacturers deal with ever increasing cost structures resulting from more complex designs. These materials boast higher etch selectivity than anything currently on the market - thus enabling patterning architectures previously unavailable with conventional techniques.
/INS . Rapidly emerging global megatrends such as Internet of Things, augmented reality as well as new waves of automotive and security related applications have become key factors in an increasing demand for imaging sensors. The growing number of different applications place new requirements for materials within these sensors which are based on integrated semiconductor optical devices and systems. These are sensors similar to those traditionally found in mobile phones and other hand-held devices. Tailored materials with outstanding optical clarity, reliability and variable indexes of refraction are needed to improve the performance these specialized devices.